SK hynix showcases 16-layer HBM4 and AI memory lineup at CES 2026
SK hynix presented its next-generation high-bandwidth and low-power memory portfolio for AI systems at CES 2026.

Evidence notes
- SK hynix showcased its AI memory portfolio at CES 2026 under the theme Spotlight on AI Memory.
- The company highlighted 16-layer HBM4 with 48 GB capacity alongside products including SOCAMM2 and LPDDR6.
- The lineup supports accelerated AI hardware used by robotics and physical AI developers.
Company context
Memory supplier providing HBM and advanced DRAM for AI accelerators including NVIDIA GPUs.