Kunwei Technology raises RMB 100M+ B++ round for force sensors
Kunwei Technology closed a B++ funding round exceeding RMB 100 million to expand high-precision force sensor production for robotics.
Evidence notes
- The B++ round exceeded RMB 100 million.
- Funding supports six-axis force/torque sensor and joint torque sensor production for robotics and automation.
- Investors included CITIC Capital Stone, Tianqi, Foxconn, Huatai Zijin and CICC Capital.