XFEON raises more than RMB 300M for physical-AI infrastructure

Jul 6, 2026 · Funding · XFEON · Ai Compute

XFEON completed a new financing round of more than RMB 300 million led by Dingxu Investment, with participation from Capinfo, Gaojie Capital and Eucalyptus Capital.

XFEON company media
Company media · XFEON
  • The funding will support next-generation physical-AI chips, embodied-intelligence data flywheels and embodied-intelligence brain systems.
  • XFEON is a Chengdu company founded in 2021 and is moving from compute services toward physical AGI infrastructure.