Mobilint Timeline
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2026-10-22 - Capability - Mobilint details integrated humanoid AI computing platform project
- The software stack covers AI-model conversion, optimization and execution alongside accelerator and module development. The project targets lower power consumption and processing delay when AI outputs are connected to physical robot motion. Planned… -
source: edaily.co.kr
2026-10-01 - Contract Award - SEMIFIVE signs Mobilint turnkey robotics AI chip development contract
- The proposed chip targets agricultural and outdoor robots that must process vision and sensor data with limited server connectivity. Planned interfaces include LPDDR6, PCIe Gen6 and UCIe-S chiplet interconnects. Mobilint defines performance targets under… -
source: prnewswire.com
2026-09-30 - Partnership - AIDIN Robotics joins Doosan-led on-device AI gripper programme
- Doosan Robotics leads the project through December 2030, developing the cobot body and controller while Mobilint develops the AI semiconductor. AIDIN is developing two-finger and multi-finger grippers with embedded force/torque and tactile sensors, with… -
source: epnc.co.kr
2026-09-28 - Award - Mobilint selected for four on-device AI semiconductor programmes
- Mobilint is developing robot-specific AI chips with LG Electronics, Doosan Robotics and Daedong, with validation on the partner platforms. The Doosan-led cobot project runs through December 2030; Doosan develops the robot and controller while AIDIN develops… -
source: zdnet.co.kr
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