Mobilint

Summary

About

About Mobilint

Founded in Seoul in 2019, Mobilint develops neural-processing silicon and software for AI inference at the edge. Its ARIES and REGULUS platforms pair accelerator hardware with a software development environment for deploying neural networks outside the data centre.

Robotics is a direct validation market: Mobilint is tailoring chips to the requirements of humanoid, collaborative and agricultural-robot manufacturers and testing them on the corresponding hardware.

PRICE
Range 1Y
Return
High
Low
Updated
DATA: KORTHOS

Supply

Supply chain relationships

  • SEMIFIVE

    Inbound - Manufacturing Services - SEMIFIVE will provide turnkey chip development and production services for Mobilint’s robotics AI chip

    Source

Team

  • Dongjoo Shin - Founder, Chief Executive Officer and Chief Technology Officer - Leads Mobilint's NPU and software roadmap across ARIES, REGULUS and robot-specific on-device AI programmes.

Timeline

Events

  • 2026-10-22 - Capability - Mobilint details integrated humanoid AI computing platform project

    The software stack covers AI-model conversion, optimization and execution alongside accelerator and module development. The project targets lower power consumption and processing delay when AI outputs are connected to physical robot motion. Planned validation includes real robot control and power-efficiency assessment under a government technology-development programme.

    Source
  • 2026-10-01 - Contract Award - SEMIFIVE signs Mobilint turnkey robotics AI chip development contract

    The proposed chip targets agricultural and outdoor robots that must process vision and sensor data with limited server connectivity. Planned interfaces include LPDDR6, PCIe Gen6 and UCIe-S chiplet interconnects. Mobilint defines performance targets under SEMIFIVE’s Spec Hand-off model.

    Source
  • 2026-09-30 - Partnership - AIDIN Robotics joins Doosan-led on-device AI gripper programme

    Doosan Robotics leads the project through December 2030, developing the cobot body and controller while Mobilint develops the AI semiconductor. AIDIN is developing two-finger and multi-finger grippers with embedded force/torque and tactile sensors, with safety tests supporting international certification work. A force/tactile data SDK will record and replay standardised training data, with logistics and manufacturing validation planned before commercialisation.

    Source
  • 2026-09-28 - Award - Mobilint selected for four on-device AI semiconductor programmes

    Mobilint is developing robot-specific AI chips with LG Electronics, Doosan Robotics and Daedong, with validation on the partner platforms. The Doosan-led cobot project runs through December 2030; Doosan develops the robot and controller while AIDIN develops sensor-integrated two-finger and multi-finger grippers. AIDIN also plans a force-and-tactile data collection SDK, followed by logistics and manufacturing trials before commercialisation.

    Source

Relations

Relationships

  • Daedong

    Agricultural Robot AI Chip Development - Mobilint is developing and validating an on-device AI semiconductor for Daedong autonomous agricultural robots.

  • Doosan Robotics

    Collaborative Robot AI Chip Development - Mobilint is developing and validating an on-device AI semiconductor for Doosan Robotics collaborative robots.

  • LG Electronics

    Humanoid AI Chip Development - Mobilint is developing an integrated humanoid NPU, accelerator module and model-conversion/optimization/runtime stack, with validation planned in LG Electronics’ humanoid environment.

Context

Comparable profiles

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  • Visinex

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Shared workflows

Context tags

  • Edge AI compute - Capability - https://www.mobilint.com/about - exact-company evidence reviewed during today-new-supply-profile-qa-2026-09-28-run20.
  • Edge AI accelerator supplier - Peer Group - https://www.mobilint.com/about - exact-company evidence reviewed during today-new-supply-profile-qa-2026-09-28-run20.
  • Edge AI inference - Workflow - https://www.mobilint.com/about - exact-company evidence reviewed during today-new-supply-profile-qa-2026-09-28-run20.

Commercial

  • SEMIFIVE signs Mobilint turnkey robotics AI chip development contract

    2026-10-01 · Order / contract · SEMIFIVE will develop a custom Mobilint robotics AI chip under Korea’s K-On-Device semiconductor programme, covering specification through design, packaging, testing and production services.

    Source