Amkor breaks ground on Arizona advanced packaging and test campus
Evidence notes
- Amkor Technology broke ground on a new advanced semiconductor packaging and test campus in Arizona.
- The company expanded planned investment for the site to $7 billion across two phases.
- The facility is relevant to robotics and physical AI through advanced packaging capacity for AI, high-performance computing, mobile and automotive silicon.
Company context
Amkor Technology provides outsourced semiconductor packaging and test services used across automotive, industrial, AI and connected-device markets.