TSMC and Amkor announce 10-year Arizona advanced-packaging partnership
TSMC and Amkor announced a 10-year partnership to accelerate advanced semiconductor packaging capabilities in Arizona.
Evidence notes
- The agreement built on the companies' Arizona advanced-packaging collaboration.
- The partners framed the work around strengthening U.S. semiconductor supply-chain capacity.
- The announcement linked TSMC's wafer manufacturing with Amkor's outsourced packaging and test operations.
Company context
Amkor Technology provides outsourced semiconductor packaging and test services used across automotive, industrial, AI and connected-device markets.