Amkor and TSMC sign Arizona advanced-packaging collaboration MOU
Amkor and TSMC signed a memorandum of understanding to collaborate on advanced packaging and test capabilities in Arizona.
Evidence notes
- The companies said the collaboration would bring advanced packaging and test capabilities to Arizona.
- The MOU was tied to expanding the regional semiconductor ecosystem.
- The partnership connected Amkor's packaging project with TSMC's Arizona manufacturing footprint.
Company context
Amkor Technology provides outsourced semiconductor packaging and test services used across automotive, industrial, AI and connected-device markets.