VACTRA-Pinnacle Context

Specifications

• Axes: Eight controlled
• Body Size: Ø372 × 530 mm body
• Reach Mm: R-axis stroke up to 680 mm centre to centre
• Vertical Lift Mm: Z-axis stroke
• Arm Configuration: Dual-arm scissor mechanism with four independently controlled hands
• Operating Environment: High-vacuum semiconductor process equipment
• Workflow Focus: Multi-wafer loading, unloading and chamber exchange