Cincoze
About
About Cincoze
Cincoze separates its embedded-computer families by performance, expansion and installation requirements. DS systems provide PCIe expansion, compact DX systems address constrained spaces, and GP and GM computers add GPU processing for workloads such as machine vision. Industrial panel PCs and monitors provide the operator-interface side of the same equipment architecture.
Its modular approach uses expansion interfaces and accessory modules to adapt networking, industrial I/O and power functions to an application. Fanless construction and rugged mechanical design address deployment in machines, transportation equipment and factory environments. Equipment builders can select the compute platform, accelerator and interface combination around the workload, rather than designing each computer assembly from scratch.
Products
Supply
Timeline
Events
- 2026-10-13 - Capability - Cincoze computers used in drone-control and counter-drone systems
The DI-1200 targets compact, low-power installations with configurable communications and positioning interfaces. DS-1302 supports expansion cards and multiple displays for ground-control work. The GM-1100 offering supports Intel Core processors and NVIDIA MXM GPU modules for edge-AI work.
Source - 2026-06-09 - Demonstration - Cincoze previews Edge AI and automation solutions for Automate 2026
Cincoze announced a four-zone Edge AI and automation showcase for Automate 2026, covering DIN-Rail computers, industrial HMI, rugged embedded systems, and GPU computers. Its MD-3000 DIN-Rail platform is positioned for machine vision and smart manufacturing, with Intel Core processors, up to 96 GB DDR5, NVMe storage, PoE, and modular I/O. The company said the GM-1100 GPU computer is suited to autonomous mobile equipment, vehicle applications, and image recognition in compact, rugged deployments.
Source - 2025-10-16 - Product Launch - Cincoze launches MAGNET DIN-rail computer line
The MD-3000 supports 12th-, 13th- and 14th-generation Intel Core processors, up to 96 GB DDR5 memory and dual NVMe SSDs. Its modular architecture combines two-, four- or six-slot expansion decks with hot-swappable I/O, PoE, M.2 and storage modules. The 150 mm-high DIN-rail system is specified for -40°C to 65°C operation and 9–48 VDC input.
Source