EGIDE
About
About EGIDE
EGIDE’s packages create a sealed mechanical and electrical interface around sensitive chips, sensors and optical components. The company joins ceramics, metals and glass while managing feedthroughs, thermal expansion and heat removal, protecting devices from moisture, contamination and pressure changes in demanding environments.
Its HTCC operation is vertically integrated from ceramic powders and conductive inks through multilayer fabrication, metallisation, brazing, plating and hermetic testing. EGIDE works with customers on package geometry and material selection before manufacturing in France and the United States, making custom engineering and qualification part of the delivery model.
Funding
Investors
- Eurazeo - Lead - Unknown - 1 funding event - first seen 2026-03-23
- Expeditions - Lead - Unknown - 1 funding event - first seen 2026-03-23
- Galion.exe - Participant - Unknown - 1 funding event - first seen 2026-03-23
- Heartcore Capital - Lead - VC - 1 funding event - first seen 2026-03-23
- Kima Ventures - Participant - VC - 1 funding event - first seen 2026-03-23
Team
- Simon Calonne - Co-Founder
Timeline
Events
- 2026-03-23 - Funding - EGIDE raises €8M seed round to build affordable interceptor systems for modern warfare
EGIDE raised an €8 million seed round to develop affordable air-defence systems aimed at intercepting hostile drones and other mass-produced strike threats. Public coverage says the company is building electrically propelled interceptors alongside a software platform for detection, classification, and interception. The financing puts real capital behind a defence-autonomy company focused on low-cost counter-drone systems rather than traditional high-cost munitions.
Source - 2026-03-13 - Market Signal - EGIDE uses TechInnov 2026 appearance as market-visibility signal
EGIDE announced its participation at TechInnov 2026 through its official news page. The event reflects early public visibility-building around the company's defence and counter-drone positioning rather than a product launch or contract award.
Source