Winbond

Summary

About

About Winbond

Winbond manufactures specialty memory for embedded and edge-computing systems, including serial NOR and NAND flash, specialty and mobile DRAM, HyperRAM and secure flash. These devices store boot code, models and working data beside microcontrollers and application processors, making them relevant to robot controllers, industrial vision, connected sensors and other hardware where board area, power consumption and component longevity matter.

HyperRAM combines a self-refreshing DRAM architecture with a low-pin-count HyperBus interface, reaching 400 megabits per second per pin in current families while reducing routing complexity. Winbond offers densities from 32 to 512 megabits in compact packages for industrial, automotive and AI-at-the-edge designs. Its wider portfolio allows equipment makers to pair working memory with code-storage flash and hardware security components from a mass-production semiconductor supplier.

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Supply

Supply chain relationships

  • Lumenier

    Outbound - electronics and robotics components - Lumenier specifies W25Q128JV flash memory in its current LUX H743 controller

    Source
  • RadioMaster

    Outbound - electronics and robotics components - RadioMaster NEXUS integrates Winbond W25N01GVZEIG flash memory

    Source

Timeline

Events

Context

Comparable profiles

  • Netlist

    comparable profile - Memory Semiconductor Supplier

Context tags

  • Memory Semiconductor Supplier - Peer Group
  • Edge AI Memory - Stack Layer
  • Embedded Memory - Stack Layer
  • Low-Power Memory - Capability
  • Industrial Automation Electronics - Customer Environment
  • IoT Device Memory - Workflow