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Company profile

Winbond

Winbond manufactures memory semiconductors including DRAM, specialty DRAM, mobile memory and flash products. Its chips support embedded electronics, indust...

Facts

Segment
SEMICONDUCTORS
Country
Taiwan
Headquarters
Taichung
Founded
1987
Ticker
2344
Website
https://www.winbond.com/

About Winbond

Winbond manufactures specialty memory for embedded and edge-computing systems, including serial NOR and NAND flash, specialty and mobile DRAM, HyperRAM and secure flash. These devices store boot code, models and working data beside microcontrollers and application processors, making them relevant to robot controllers, industrial vision, connected sensors and other hardware where board area, power consumption and component longevity matter.

HyperRAM combines a self-refreshing DRAM architecture with a low-pin-count HyperBus interface, reaching 400 megabits per second per pin in current families while reducing routing complexity. Winbond offers densities from 32 to 512 megabits in compact packages for industrial, automotive and AI-at-the-edge designs. Its wider portfolio allows equipment makers to pair working memory with code-storage flash and hardware security components from a mass-production semiconductor supplier.

Market context

SUPPLY_CHAIN

Summary

Type: Memory supplier

Core: DRAM / flash

Function: Compute

Audience: Electronics OEMs

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