Winbond
About
About Winbond
Winbond manufactures specialty memory for embedded and edge-computing systems, including serial NOR and NAND flash, specialty and mobile DRAM, HyperRAM and secure flash. These devices store boot code, models and working data beside microcontrollers and application processors, making them relevant to robot controllers, industrial vision, connected sensors and other hardware where board area, power consumption and component longevity matter.
HyperRAM combines a self-refreshing DRAM architecture with a low-pin-count HyperBus interface, reaching 400 megabits per second per pin in current families while reducing routing complexity. Winbond offers densities from 32 to 512 megabits in compact packages for industrial, automotive and AI-at-the-edge designs. Its wider portfolio allows equipment makers to pair working memory with code-storage flash and hardware security components from a mass-production semiconductor supplier.
Supply
Timeline
Events
- 2023-09-27 - Product Launch - Winbond introduces CUBE memory architecture for edge AI devices
CUBE supports memory densities from 256 Mb to 8 Gb per die and can be 3D stacked to increase bandwidth. Specified performance spans 32 to 256 GB/s per die with power consumption below 1 pJ per bit. Target applications include edge devices, ADAS, surveillance equipment and collaborative robots.
Source
Context
Comparable profiles
- Netlist
comparable profile - Memory Semiconductor Supplier
Context tags
- Memory Semiconductor Supplier - Peer Group
- Edge AI Memory - Stack Layer
- Embedded Memory - Stack Layer
- Low-Power Memory - Capability
- Industrial Automation Electronics - Customer Environment
- IoT Device Memory - Workflow