Dragonwing RB3 Gen 2 Core Kit

Qualcomm Dragonwing RB3 Gen 2 Core Kit is an embedded development platform built around the QCS6490 processor. It gives robotics and edge-device developers a reference environment for evaluating on-device AI, multimedia and connectivity before designing production hardware. The modular 96Boards-compatible layout exposes display, camera, USB, Ethernet and general-purpose I/O connections, while two expansion interfaces support C-PHY and D-PHY peripherals. Qualcomm lists Linux, Ubuntu, Android and Windows among the supported software environments.

The processor provides up to 12 dense TOPS of AI performance, alongside Wi-Fi 6E, Bluetooth 5.2 and an onboard inertial measurement unit. The Core Kit is the base configuration and does not include the camera set supplied with the separate Vision Kit, an important boundary when comparing demonstrations or expected functionality. It is a developer kit, not a finished robot controller: production suitability, thermal design, safety, enclosure, peripheral choice and long-term software maintenance remain responsibilities of the device integrator.