Goertek Microelectronics
About
About Goertek Microelectronics
Established in Qingdao in 2017 from Goertek’s earlier microelectronics business, Goertek Microelectronics combines sensor-chip development, packaging, testing and module production. The company reports more than RMB4.5 billion of 2024 revenue and operates manufacturing bases in China and Vietnam, with products serving consumer, automotive, industrial, smart-home and healthcare markets.
For robotics and drones, the relevant layer is compact environmental and motion-adjacent sensing. Goermicro’s MEMS pressure-sensor family provides altitude and pressure inputs for flight electronics, and an SPA06-003 is specified in HGLRC’s current H743 8S Mini controller. The company also develops 3D ToF and RGB-depth camera modules, but Korthos keeps sensor chips as the primary Detail because that is the exact evidenced supply tier in the current drone chain.
Supply
Timeline
Events
- 2025-05-15 - Partnership - Goertek Microelectronics and Infineon collaborate on industrial 3D ToF cameras
The collaboration combines Goertek Microelectronics’ camera-module and sensing integration with Infineon’s time-of-flight technology. Target applications include robotic depalletizing, pallet recognition and perception for unmanned forklifts and AMRs. The planned camera products address industrial depth sensing rather than the company’s separate consumer-electronics portfolio.
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Context
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Context tags
- Machine vision - Stack Layer - Official and recipient product evidence reviewed: https://en.goermicro.com/ | https://en.goermicro.com/about/index.html | https://industry.goermicro.com/ |…