Infineon Technologies

• XENSIV BGT60TR13C

Supply chain relationships

• TanKeBlue

  Inbound - Semiconductor Materials - TanKeBlue contracted to supply 150 mm SiC wafers for Infineon semiconductor manufacturing

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• Coherent Corp.

  Inbound - Semiconductor Materials - Coherent is named in Infineon's contracted SiC substrate material supply base

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• SICC

  Inbound - Semiconductor Materials - SICC is contracted in Infineon's SiC substrate material supply base for semiconductor production

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• GT Advanced Technologies

  Inbound - Semiconductor Materials - GTAT agreed to supply 150 mm SiC boules for Infineon wafer production under a five-year initial term

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• Wolfspeed

  Inbound - Semiconductor Materials - Wolfspeed's extended agreement reserves 150 mm SiC wafer capacity for Infineon's semiconductor production

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• SkyWater Technology

  Inbound - Manufacturing Services - SkyWater contracted to provide Infineon with semiconductor foundry supply from Fab 25 in Austin

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• TanKeBlue

  Inbound - Semiconductor Materials - TanKeBlue contracted to supply 150 mm SiC boules for Infineon semiconductor manufacturing

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• Resonac

  Inbound - Semiconductor Materials - Resonac's multi-year agreement supplies 6-inch SiC materials for Infineon's SiC semiconductor production

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• SK Siltron CSS

  Inbound - Semiconductor Materials - SK Siltron CSS contracted to supply 150 mm SiC wafers for Infineon's SiC semiconductor production

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• Advanced Micro Devices

  Outbound - Compute & Control - Kria KR260 Robotics Starter Kit uses Infineon TPM 2.0 security module

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• G-Pulse Electronics

  Outbound - Motor Control - G-Pulse integrates an Infineon EiceDRIVER gate driver in its 48 V robotics servo driver

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• G-Pulse Electronics

  Outbound - Power Electronics - G-Pulse integrates Infineon CoolGaN power transistors in its 48 V robotics servo driver

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• G-Pulse Electronics

  Outbound - Sensing - G-Pulse integrates an Infineon XENSIV TLI4971 current sensor in its 48 V robotics servo driver

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• G-Pulse Electronics

  Outbound - Motor Control - G-Pulse integrates an Infineon PSOC Control C3 MCU in its 48 V robotics servo driver

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• Matek Systems

  Outbound - robotics sensors - Matek H743-WLITE integrates an Infineon DPS310 barometer

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• mRobotics (mRo)

  Outbound - Sensing Perception - mRo Control Zero OEM H7 incorporates an Infineon DPS310 barometer

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• Holybro

  Outbound - Sensing Perception - Holybro Kakute G4 AIO 35A integrates Infineon DPS310 barometer

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• Reflex Drive

  Outbound - Power Energy - Reflex Drive incorporates Infineon OptiMOS power devices and MOTIX IMD701 motor controllers in its UAV electronic speed controllers

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• HGLRC

  Outbound - Sensing Perception - HGLRC SPECTER 25A AIO integrates Infineon DPS310 barometer

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• Foxeer

  Outbound - Sensing Perception - Foxeer H7 MPU6000 flight controllers incorporate an Infineon DPS310 barometer

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• Lumenier

  Outbound - robotics sensors - Lumenier specifies the Infineon DPS368 barometer in its current LUX H743 controller

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• Ecotron

  Outbound - Safety Control - Ecotron EAORA07 uses an Infineon TC397XP safety microcontroller

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• iFlight

  Outbound - robotics sensors - iFlight BLITZ F7 integrates an Infineon DPS310 barometer

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• SolidRun

  Outbound - Compute & Control - SolidRun Bedrock RAI300 includes an Infineon discrete TPM selectable through BIOS

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• Ecotron

  Outbound - Safety Control - Ecotron EAORA06 uses an Infineon TC397XP safety microcontroller

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• HGLRC

  Outbound - robotics sensors - HGLRC SPECTER F722 integrates an Infineon DPS310 barometer

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• Ecotron

  Outbound - Safety Control - Ecotron EAORA10 uses an Infineon TC377TP microcontroller

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• ModalAI

  Outbound - robotics sensors - ModalAI states its M0178 module uses the active Infineon IRS2975C ToF image sensor

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• FlyingRC

  Outbound - robotics sensors - FlyingRC lists Infineon DPS310 or DPS368 barometers for its H7D H743 controller

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• Foxeer

  Outbound - robotics sensors - Foxeer F405 V2 integrates an Infineon DPS310 barometer

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• GEPRC

  Outbound - robotics sensors - Current GEPRC GEP-M10 variants integrate Infineon DPS310 or DPS368 barometers

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• Micropolis Robotics

  Outbound - electronics and robotics components - Infineon supplies microcontrollers and electronic components for Micropolis AMRs

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• T-MOTOR

  Outbound - robotics sensors - T-MOTOR’s H7 Mini flight controller incorporates an Infineon DPS310 barometer

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• Ecotron

  Outbound - Safety Control - Ecotron EATHA06 uses an ASIL-D-rated Infineon TC397 microcontroller

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• Raspberry Pi

  Outbound - electronics and robotics components - Current wireless Pico boards integrate Infineon CYW43439 connectivity silicon

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• Axisflying

  Outbound - robotics sensors - Axisflying specifies the Infineon DPS368 barometer in the current Bando 5

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• Team BlackSheep

  Outbound - robotics sensors - Team BlackSheep integrates the Infineon DPS310 barometer in its Lucid H7 Wing

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• DH-Robotics

  Outbound - Compute & Control - DH-Robotics electric grippers incorporate Infineon power MOSFETs, control chips, Hall sensors and gate drivers

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• IFX - XETRA - EUR

• Jochen Hanebeck - Chief Executive Officer
• Dr. Sven Schneider - Chief Financial Officer - This role identifies Dr. Sven Schneider as part of Infineon Technologies's leadership or founding team.
• Andreas Urschitz - Chief Marketing Officer

Events

• 2026-07-30 - Demonstration - Fabmatics validates HERO Scout in Infineon Dresden cleanroom trial

  The trial used dummy reticle SMIF pods and 200 mm wafer carriers across transport, handling and narrow-aisle navigation scenarios. A vision-guided gripper handled load-port position deviations without reteaching, while obstacle and personnel-interaction tests confirmed safe operation. The prototype combined a six-axis collaborative arm with SLAM-based route learning, AI-enabled local control and inductive on-the-fly charging.

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• 2026-07-01 - Acquisition - Infineon closes ams OSRAM non-optical sensor acquisition

  The acquired products cover position, capacitive and temperature sensing used across automotive, industrial and robotics systems. Infineon estimated that the transferred business would generate about EUR 230 million of revenue in calendar 2026. Infineon says the acquired business is expected to generate about EUR230 million revenue in calendar 2026.

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• 2026-06-09 - Partnership - Vingroup's VinRobotics partners with Infineon on next-generation robotics technologies

  VinRobotics signed an MoU with Infineon Technologies to explore next-generation robotics applications based on advanced semiconductor technology. The collaboration includes a planned VinRobotics-Infineon Competency Center inside VinRobotics facilities. Infineon will participate in VinRobotics robotics projects from early development stages, supporting technical exchange and co-innovation around intelligent robots.

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• 2026-03-16 - Partnership - Infineon accelerates deployment of robots with improved safety and security features using digital twins in collaboration with NVIDIA

  Infineon expands its NVIDIA collaboration around digital-twin-based workflows for safer robot deployment The collaboration targets robot system architectures using Infineon components alongside the NVIDIA robotics stack

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• 2026-02-03 - Acquisition - Infineon acquires non-optical analog and mixed-signal sensor portfolio from ams OSRAM

  The EUR 570 million cash consideration covered a business expected to generate about EUR 230 million of calendar-2026 revenue and transfer roughly 230 R&D employees. The portfolio includes position, capacitive and temperature sensors plus associated intellectual property, development assets, test equipment and a multi-year supply arrangement. Infineon identified angle and position sensing for robotics as an application strengthened by the transaction; ams OSRAM retained its optical-sensing focus.

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• 2025-08-25 - Partnership - Infineon collaborates with NVIDIA on motor control and sensing architecture for humanoid robotics

  Infineon brings microcontrollers, sensors, and smart actuators into the NVIDIA Jetson Thor humanoid robotics ecosystem The collaboration focuses on scalable motor-control and embedded-control architectures for humanoid OEMs and ODMs It marks a clear robotics-specific ecosystem move rather than a generic semiconductor announcement

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• 2025-06-04 - Partnership - Reflex Drive selects Infineon devices for high-performance UAV motor control

  Reflex Drive selected Infineon OptiMOS 80 V and 100 V power devices plus the MOTIX IMD701 controller for next-generation UAV electronic speed controllers. The combination is designed to improve thermal management, efficiency, flight-control precision, and reliability in a compact motor-control package. Reflex Drive’s ESCs were specified at up to 3.8 kW continuous output and positioned for drones used in agriculture, logistics, goods transport, and industrial inspection.

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• 2025-02-28 - Partnership - Infineon sensor technology enables Roborock robot vacuum with integrated 5-axis robot arm

  Roborock uses Infineon's REAL3 Time-of-Flight technology in the Saros Z70 robotic vacuum The sensor package enables navigation, object recognition, and integration of a 5-axis robot arm in the cleaner The design win shows direct consumer robotics relevance for Infineon's sensor stack

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• 2023-10-30 - Partnership - Infineon and DH-Robotics introduce next-generation electric grippers

  DH-Robotics electric grippers use Infineon MOSFETs, EtherCAT microcontrollers, Hall sensors, gate-driver ICs and PSoC 6 microcontrollers. The design specifically incorporates OptiMOS 5 80 V devices BSZ075N08NS5 and BSC030N08NS5. Infineon published the collaboration on 30 October 2023 as DH-Robotics brought the electric-gripper series to market.

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• 2023-05-03 - Commercial Order - TanKeBlue signs long-term SiC supply agreement with Infineon

  The first phase uses 150 mm material; later supply is intended to support 200 mm manufacturing. The planned long-term contribution is a double-digit share of Infineon’s forecast demand.

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• 2023-05-03 - Commercial Order - SICC signs silicon carbide materials agreement with Infineon

  Initial supply covers 150 mm material, with support for a later transition to 200 mm wafers. The agreement is intended to cover a double-digit share of Infineon’s forecast long-term demand.

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• 2023-01-12 - Commercial Order - Resonac expands silicon carbide supply agreement with Infineon

  Initial six-inch material supply is intended to progress toward eight-inch wafers in later years. Infineon will provide intellectual property concerning SiC material technologies. The supply is expected to cover a double-digit share of forecast demand over the next decade.

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Relationships

• Fabmatics

  Cleanroom Trial Partner - Fabmatics and Infineon Dresden jointly evaluated the HERO Scout prototype in a 200 mm lithography cleanroom through the AIMS 5.0 programme.

• Vingroup

  Semiconductor And Robotics Technology Partner - Vingroup and Infineon signed an MoU covering semiconductor and robotics development, including support for VinRobotics humanoid platforms.

• NVIDIA

  Technology Partnership - Technology partnership with NVIDIA around robotics safety, security, and physical AI workflows

• ams OSRAM

  Sensor Portfolio Seller - Infineon acquired ams OSRAM's non-optical analog and mixed-signal sensor portfolio.

Comparable profiles

• ON Semiconductor

  stack adjacency - Power Semiconductor Component Supplier

Shared workflows

• Wolfspeed

  workflow adjacency - Power Semiconductor Supply

• SiCrystal

  workflow adjacency - Power Semiconductor Supply

• Resonac

  workflow adjacency - Power Semiconductor Supply

• TanKeBlue

  workflow adjacency - Power Semiconductor Supply

• SK Siltron CSS

  workflow adjacency - Power Semiconductor Supply

• SICC

  workflow adjacency - Power Semiconductor Supply

Context tags

• Electronics robotics supply chain - Customer Environment
• Power semiconductor supplier - Peer Group
• Power semiconductor supply - Workflow
• Power semiconductor component supplier - Stack Layer

• SICC signs silicon carbide materials agreement with Infineon

  2023-05-03 · Order / contract · The contract expands Infineon’s supply of wafers and boules.

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• TanKeBlue signs long-term SiC supply agreement with Infineon

  2023-05-03 · Order / contract · The contract covers silicon carbide wafers and boules for semiconductor production.

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• Resonac expands silicon carbide supply agreement with Infineon

  2023-01-12 · Order / contract · The multi-year contracts extend the companies’ earlier materials cooperation.

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